Milestones

Hua Hsu Silicon Materials was founded in 2010, focusing on the solar auxiliary materials market and establishing a prominent position in the industry.
In 2016, the company began dedicating efforts to semiconductor research and development, expanding its business to the semiconductor wafer field in 2017.
The focus was on Silicon wafer reclamation and test wafer process development.
 
To enhance service quality and ensure stable production, the company gradually introduced 6" & 8" wafer flattening processes in 2020. A dust-free environment meeting semiconductor standards was established, along with comprehensive cleaning equipment. Starting in 2021, the company customized products based on customer orders.
 
Simultaneously, to strengthen Hua Hsu Silicon Materials and adapt to the semiconductor market, efforts were made to diversify and enhance Silicon wafer product types and specifications. The company actively collaborated with renowned domestic and international manufacturers to develop advanced technologies and obtain high-value products.
 
In late 2021, the planning for the third-generation semiconductor-related wafer processes began. The company initiated the construction of 6-inch silicon carbide wafer processes, gradually planning and building epitaxial growth for 6" SiC.
In 2023, it officially joined the ranks of mass production.
 
Milestones:
 
•2010/01: Establishment of HUA HSU OPTOTECH
•2012/06: Processing of polycrystalline silicon blocks
•2016: Ranked among the top three polycrystalline silicon processing plants in Asia
•2016: Specialized in diamond wire saw cutting and diamond wire production
•2018/01: Joined Giga Diamond Materials Corporation
•2019: Layout for silicon wafer processing and production began
•2020/11: Obtained ISO9001 certification
•2021/08: Establishment of dust-free semiconductor-grade facilities
•2021/10: Research and development of diamond wire production for cutting high-hardness materials
•2022/07: Initiated counseling and implementation of IATF-16949 quality system
•2022/10: Merged with Giga Diamond to become Hua Hsu Silicon Materials
Small-scale trial production of Si and SiC wafers
•2022/12: Introduction of new products
•6-inch SiC wafer
•6-inch/8-inch Si test wafer
•Semi-grade p-Silicon and Si powder
•2023: Commencement of formal production of SiC Pri-Wafer
•2023-09: SiC Epitaxial Wafer ready
•2024-03: Obtained IATF16949 certification